Half-hole
ModulePCB

Material:FR-4 ;Layer:4L;

FinishBoardThickness:1.2mm;

MinLineWidth/Space:4/3mil;

MinHoleSize:0.15mm; SurfaceFinish:ENIG

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● IPC-A-600Acceptability of Printed Boards
● IPC-A-600Acceptability of Printed Boards
● IPC-A-600Acceptability of Printed Boards
● IPC-A-600 Acceptability of Printed Boards
● IPC-A-600 Acceptability of Printed Boards
● IPC-A-600 Acceptability of Printed Boards
PCB Manufacture

Types

PCB Manufacture

Technical Specifications

PCB Manufacture

Materials

PropertyFR-4Standard/High TGAluminumMetal CoreRogersHigh FrequencyCeramicAlumina/AlN
Thermal Conductivity0.25 W/m·K1.0 – 3.0 W/m·K0.5 – 0.8 W/m·K24 – 170 W/m·K
Dielectric Constant4.2 – 4.6N/A2.2 – 3.59.0 – 10.0
Operating TempUp to 170°CUp to 150°CUp to 280°CUp to 800°C
CTE (Z-axis)50-70 ppm20-25 ppm30-45 ppm4-7 ppm
Durability
Cost Level
Best ForGeneral purpose electronicsHigh-power LEDs, AutomotiveRF, 5G, Radar SystemsAerospace, High-power modules
● Green = performance level · Amber = relative cost (more dots = higher cost) · LCP column highlighted as premium RF substrate
PCB Manufacture

Manufacturing Process

Material Preparation
Material Preparation
Flexible laminates are precision-cut to format. Thickness is verified to +5um and surface cleanliness confirmed before any subsequent processstep begins.
Polyimide
PET
LCP
PCB Manufacture

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